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A new method of making particleboard with a formaldehyde-free soy-based adhesive

A new method of making particleboard with a formaldehyde-free soy-based adhesive
Learning Objets
Summary
This study presents a novel method for producing particleboard using a formaldehyde-free adhesive composed of soy flour (SF) and a curing agent (CA). Traditional soy-based adhesives are too viscous for direct application in particleboard manufacturing. To overcome this, the researchers developed a two-step process: first coating wood particles with a dilute soy slurry, followed by drying and application of the curing agent. The mechanical properties of the resulting particleboard—internal bond strength (IB), modulus of rupture (MOR), and modulus of elasticity (MOE)—were evaluated under varying conditions such as board density, adhesive ratios, press time and temperature, and storage duration. The results demonstrated that particleboard produced using this method meets or exceeds industry standards, offering a sustainable alternative to urea-formaldehyde resins.

This Learning Object is highly relevant for university students studying Green Chemistry, materials science, and sustainable engineering. It exemplifies the application of renewable resources and safer chemical processes in industrial manufacturing, aligning with key principles of Green Chemistry such as the use of renewable feedstocks, design of safer chemicals, and reduction of hazardous substances.

Authors/Contributors:
Lapyote Prasittisopin, Kaichang Li
Materials Science Program, Department of Wood Science and Engineering, Oregon State University, Corvallis, OR, USA

Citation:
Prasittisopin, L., & Li, K. (2010). A new method of making particleboard with a formaldehyde-free soy-based adhesive. Composites: Part A, 41(10), 1447–1453. https://doi.org/10.1016/j.compositesa.2010.06.006
Keyword Tags
Renewable Feedstocks
Soy Chemistry
Adhesives
Mechanical Properties
Biomaterials
Materials Science
Polymer Chemistry
Link to external
Link to journal article
Learning Goals/Student Objectives
Learning Goals
1. Understand the environmental and health impacts of traditional wood adhesives and the need for formaldehyde-free alternatives.
2. Explore the chemical and physical principles behind adhesive formulation and performance in composite materials.
3. Analyze experimental design and data interpretation in the context of materials testing and optimization.
4. Apply Green Chemistry principles to the development of sustainable industrial processes.
5. Evaluate trade-offs in material design, including cost, performance, and sustainability.

Student Objectives
By the end of this module, students will be able to:
1. Describe the challenges and solutions in replacing formaldehyde-based adhesives with soy-based alternatives.
2. Explain the role of soy flour and curing agents in forming thermosetting adhesives for particleboard.
3. Interpret mechanical property data (IB, MOR, MOE) and assess whether materials meet industry standards.
4. Design an experiment to test alternative adhesive formulations or processing conditions.
5. Discuss how this method aligns with Green Chemistry principles such as safer chemical design and use of renewable feedstocks.
6. Critically evaluate the scalability and industrial feasibility of sustainable adhesive technologies.
Object Type
Case studies
Journal articles
Audience
Upper/Advanced Undergraduate
Common pedagogies covered
Blended learning
Context-based learning
Green Chemistry Principles
Waste Prevention
Less Hazardous Chemical Syntheses
Use of Renewable Feedstocks
Design for Degradation
Safer Chemistry for Accident Prevention
U.N. Sustainable Development Goals (SDGs)
Good Health and Well-Being
Industry, Innovation and Infrastructure
Responsible Consumption and Production
Climate Action
Life on Land
Safety Precautions, Hazards, and Risk Assessment
Chemical Hazards
Soy Flour (SF): Low toxicity but may cause respiratory irritation as airborne dust. Use dust masks or local exhaust ventilation during mixing.

Curing Agent (CA1000): Aqueous polymer solution; may cause skin or eye irritation. Wear gloves and safety goggles during handling.

Physical Hazards
Hot-Pressing Equipment: Operates at high temperatures (up to 190 °C) and pressure. Risk of burns and crush injuries; use heat-resistant gloves and follow safety protocols.

Rotary Dryer and Blender: Moving parts pose entanglement and pinch hazards. Keep hands clear and wear fitted clothing.

Environmental Hazards
Waste Disposal: Dispose of adhesive residues and wood dust according to institutional and environmental guidelines. Avoid release of polymer solutions into drains.

Safety Precautions
Use PPE: lab coat, gloves, safety goggles, and heat-resistant gloves.
Ensure adequate ventilation during mixing and drying.
Follow equipment safety procedures for hot press and rotary dryer.
Keep a fire extinguisher and first aid kit nearby.

Risk Assessment
Identify all hazardous materials and equipment.
Evaluate exposure routes: inhalation, skin contact, thermal injury.
Implement engineering controls: fume hoods, guards, and interlocks.
Train personnel on emergency response, including burn treatment and chemical exposure.

Maintain Material Safety Data Sheets (MSDS) for all reagents.
NGSS Standards, if applicable
Disciplinary Core Ideas (DCIs)
HS-PS1-3: Plan and conduct an investigation to gather evidence to compare the structure of substances at the bulk scale to infer the strength of interactions between particles.
The study investigates how soy-based adhesives interact with wood particles and how formulation variables affect mechanical strength.

HS-PS2-6: Communicate scientific and technical information about why the molecular-level structure is important in the functioning of designed materials.
Students can explore how the chemical structure of soy proteins and curing agents contributes to adhesive performance.

HS-ETS1-3: Evaluate a solution to a complex real-world problem based on prioritized criteria and trade-offs.
The research addresses the challenge of replacing formaldehyde-based adhesives with safer, renewable alternatives, balancing performance, cost, and environmental impact.

Science and Engineering Practices (SEPs)
Planning and Carrying Out Investigations
The study systematically varies parameters such as adhesive ratios, press time, and temperature to evaluate performance.

Analyzing and Interpreting Data
Students can analyze experimental data on internal bond strength, modulus of rupture, and elasticity to draw conclusions.

Constructing Explanations and Designing Solutions
The research provides a model for designing sustainable materials and evaluating their effectiveness.

Engaging in Argument from Evidence
Students can use the data to argue for or against the viability of soy-based adhesives in industrial applications.

Crosscutting Concepts
Structure and Function
The relationship between the molecular structure of soy adhesives and their mechanical performance is central to the study.
Cause and Effect

Changes in formulation and processing conditions lead to measurable differences in particleboard strength.

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Submitted by

Kris Weigal
Published on
Moderation state
Published
Collection
Soy Chemistry Literature